Frontiers of Mechanical Engineering >

2010 , Vol. 5 >Issue 4: 370 - 375

DOI: https://doi.org/10.1007/s11465-010-0107-9

RESEARCH ARTICLE

Development of new transient liquid phase system Au-Sn-Au for microsystem technology

  • Kirsten BOBZIN ,
  • Nazlim BAGCIVAN ,
  • Lidong ZHAO ,
  • Stefania FERRARA ,
  • Jan PERNE
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  • Surface Engineering Institute, RWTH Aachen University, Augustinerbach 4-22, 52062 Aachen, Germany

Received date: 30 Mar 2010

Accepted date: 21 May 2010

Published date: 05 Dec 2010

Copyright

2014 Higher Education Press and Springer-Verlag Berlin Heidelberg
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Abstract

In the last decade, microsystems evolved to decisive technology in many technical applications. With increasing requirements on the performance of microsystems, more and more dissimilar materials are used in the same assembly. Correspondingly, suitable joining methods are required to fulfil the requirements on good properties of joints. In this study, a new transient liquid phase (TLP) system Au-Sn-Au was developed for potential medical applications in hybrid microsystems. The high and low melting phases Au and Sn were deposited onto diverse substrates by magnetron-sputter-ion plating. The coated substrates were soldered in a microsoldering station under different conditions. The influence of soldering conditions on the microstructure and properties of the joints was investigated. Results show that the developed solder led to high-quality joints that can be used in microsystems for medical applications.

Key words： transient liquid phase; microtechnology; soldering; diffusion; physical vapor deposition (PVD)

Cite this article

Kirsten BOBZIN , Nazlim BAGCIVAN , Lidong ZHAO , Stefania FERRARA , Jan PERNE . Development of new transient liquid phase system Au-Sn-Au for microsystem technology[J]. Frontiers of Mechanical Engineering, 2010 , 5(4) : 370 -375 . DOI: 10.1007/s11465-010-0107-9

Acknowledgments

The authors gratefully acknowledge the financial support of the German Science Foundation (DFG) within the Collaborative Research Center (SFB) 440 “Assembly of Hybrid Microsystems”.

References

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