Liquid metal as energy transportation medium or coolant under harsh environment with temperature below zero centigrade

PDF(548 KB)
PDF(548 KB)
Frontiers in Energy ›› 2014, Vol. 8 ›› Issue (1) : 49-61. DOI: 10.1007/s11708-013-0285-3

作者信息 +

Liquid metal as energy transportation medium or coolant under harsh environment with temperature below zero centigrade

Author information +
History +

Abstract

The current highly integrated electronics and energy systems are raising a growing demand for more sophisticated thermal management in harsh environments such as in space or some other cryogenic environment. Recently, it was found that room temperature liquid metals (RTLM) such as gallium or its alloys could significantly reduce the electronics temperature compared with the conventional coolant, like water, oil or more organic fluid. However, most of the works were focused on RTLM which may subject to freeze under low temperature. So far, a systematic interpretation on the preparation and thermal properties of liquid metals under low temperature (here defined as lower than 0°C) has not yet been available and related applications in cryogenic field have been scarce. In this paper, to promote the research along this important direction and to overcome the deficiency of RTLM, a comprehensive evaluation was proposed on the concept of liquid metal with a low melting point below zero centigrade, such as mercury, alkali metal and more additional alloy candidates. With many unique virtues, such liquid metal coolants are expected to open a new technical frontier for heat transfer enhancement, especially in low temperature engineering. Some innovative ways for making low melting temperature liquid metal were outlined to provide a clear theoretical guideline and perform further experiments to discover new materials. Further, a few promising applied situations where low melting temperature liquid metals could play irreplaceable roles were detailed. Finally, some main factors for optimization of low temperature coolant were summarized. Overall, with their evident merits to meet various critical requirements in modern advanced energy and power industries, liquid metals with a low melting temperature below zero centigrade are expected to be the next-generation high-performance heat transfer medium in thermal managements, especially in harsh environment in space.

Keywords

liquid metal / cryogenics / low melting point / thermal management / aircraft / liquid cooling / space exploration

引用本文

导出引用
. . Frontiers in Energy. 2014, 8(1): 49-61 https://doi.org/10.1007/s11708-013-0285-3

参考文献

[1]
Chowdhury I, Prasher R, Lofgreen K, Chrysler G, Narasimhan S, Mahajan R, Koester D, Alley R, Venkatasubramanian R. On-chip cooling by superlattice-based thin-film thermoelectrics. Nature Nanotechnology, 2009, 4(4): 235 −238
CrossRef ADS Pubmed Google scholar
[2]
Arik M, Becker C, Weaver S, Petroski J. Thermal management of LEDs: package to system. In: 3rd International Conference on Solid State Lighting. San Diego, CA, 2003, 64 −75
[3]
Tzuk Y, Tal A, Goldring S, Glick Y, Lebiush E, Kaufman G, Lavi R. Diamond cooling of high-power diode-pumped solid-state lasers. IEEE Journal of Quantum Electronics, 2004, 40(3): 262−269
CrossRef ADS Google scholar
[4]
Strassberg D. Cooling hot microprocessors. EDN (European Edition), 1994, 39: 40−48
[5]
Lundquist C, Carey V P. Microprocessor-based adaptive thermal control for an air-cooled computer CPU module. In: Proceedings of the 17th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. San Jose, USA, 2001, 168−173
[6]
Xie H, Ali A, Bhatia R. Use of heat pipes in personal computers. In: Proceedings of the Intersociety Conference—Thermo Mechanical Phenomena in Electronic Systems. Seattle, USA, 1998, 442−448
[7]
Nquyen T, Mochizuki M, Mashiko K, Saito Y, Sauciuc I. Use of heat pipe/heat sink for thermal management of high performance CPUs. In: Proceedings of the 16th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. San Jose, USA, 2000, 76−79
[8]
Rao W, Zhou Y X, Liu J, Deng Z S, Ma K Q, Xiang S H. Vapor-compression-refrigerator enabled thermal management of high performance computer. International Congress of Refrigeration, Beijing, China, 2007
[9]
Amon C, Murthy J, Yao S C, Narumanchi S, Wu C F, Hsieh C C. MEMS-enabled thermal management of high-heat-flux devices EDIFICE embedded droplet impingement for integrated cooling of electronics. Experimental Thermal and Fluid Science, 2001, 25(5): 231−242
CrossRef ADS Google scholar
[10]
Tuckerman D B, Pease R F W. High-performance heat sinking for VLSI. IEEE Electron Device Letters, 1981, 2(5): 126−129
CrossRef ADS Google scholar
[11]
Ma K Q, Liu J. Liquid metal cooling in thermal management of computer chips. Frontiers of Energy and Power Engineering in China, 2007, 1(4): 384−402
CrossRef ADS Google scholar
[12]
Deng Y G, Liu J. Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices. Heat and Mass Transfer, 2010, 46(11−12): 1327−1334
CrossRef ADS Google scholar
[13]
Deng Y G, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer, 2010, 37(7): 788−791
CrossRef ADS Google scholar
[14]
Ma K Q, Liu J, Xiang S H, Xie K W, Zhou Y X. Study of thawing behavior of liquid metal used as computer chip coolant. International Journal of Thermal Sciences, 2009, 48(5): 964−974
CrossRef ADS Google scholar
[15]
Dai D, Zhou Y, Liu J. Liquid metal based thermoelectric generation system for waste heat recovery. Renewable Energy, 2011, 36(12): 3530−3536
CrossRef ADS Google scholar
[16]
Deng Y G, Liu J. Heat spreader based on room-temperature liquid metal. ASME Journal of Thermal Science and Engineering Applications, 2012, 4(2): 024501
CrossRef ADS Google scholar
[17]
Li P P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal. Applied Physics Letters, 2011, 99(9): 094106–3
CrossRef ADS Google scholar
[18]
Liu J, Zhou Y X. A computer chip cooling method which uses low melting point metal and its alloys as the cooling fluid. China Patent 02131419.5. 2002
[19]
Deng Y G, Liu J. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs. ASME Journal of Electronic Packaging, 2010, 132(3): 031009
CrossRef ADS Google scholar
[20]
Ryall J. Space probe set to “collide” with earth to simulate approaching asteroid. 2009-06-11
[21]
Weinberger S. Lockheed trumps boeing for new GPS. 2008-05-16
[22]
Coppinger R. ESA’s manned ARV team despondent over cash.
[23]
THERMACORE. Satellite thermal control: unique products for unique challenges. 2013-05-26
[24]
Zuo Z J, North M T, Wert K L. High heat flux heat pipe mechanism for cooling of electronics. IEEE Transactions on Components and Packaging Technologies, 2001, 24(2): 220−225
CrossRef ADS Google scholar
[25]
Haws J. Short E. Method and apparatus for cooling with phase change materials and heat pipes. European Patent 00965034.2–2220–US0025297. 2002
[26]
Meyer L, Dasgupta S, Shaddock D, Tucker J. Fillion R. A silicon-carbide micro-capillary pumped loop for cooling high power devices. In: 9th Annual IEEE Symposium on Semiconductor Thermal Measurement and Management. Austin, USA, 1993, 364−368
[27]
Butler D, Ku J. Swanson T. Loop heat pipes and capilary pump loops—an application perspective. In: Space Technology and Applications International Forum-STAIF. Albuquerque, USA, 2002, 49−56
[28]
Golliher E L. Microscale technology electronics cooling overview. In: Space Technology and Applications International Forum-STAIF. Albuquerque, USA, 2002, 250−257
[29]
Ohadi M, Qi J. Thermal management of harsh environment electronics. Microscale Heat Transfer Fundamentals and Applications, 2005, 193: 479−498
CrossRef ADS Google scholar
[30]
Heffington S N, Black W Z, Glezer A. Vibration-induced droplet atomization heat transfer cell for high-heat flux dissipation. Thermal Challenges in Next Generation Electronic Systems (THERMES-2002). Santa Fe, USA, 2002
[31]
Fan X, Zeng G, LaBounty C, Croke E, Vashaee D, Shakouri A, Ahn C, Bowers J E. High cooling power density SiGe/Si micro coolers. Electronics Letters, 2001, 37(2): 126−127
CrossRef ADS Google scholar
[32]
Zimm C, Jastrab A, Sternberg A, Pecharsky V Jr, Gschneidner K, Osborne M, Anderson I. Description and performance of a near-room temperature magnetic refrigerator. Advances in Cryogenic Engineering, 1998, 43: 1759−1766
[33]
Swfit G W. Thermoacoustics: A Unifying Perspective for Some Engines and Refrigerators. New York: Acoustical Society of America (ASA) Publications, 2002
[34]
Dawson V P, Bowles M D. Taming Liquid Hydrogen: The Centaur Upper Stage Rocket 1958−2002. Washington, DC: NASA Office of External Relations, 2004
[35]
Kwon D W, Sedwick R J. Cryogenic heat pipe for cooling high temperature superconductors. Cryogenics, 2009, 49(9): 514−523
CrossRef ADS Google scholar
[36]
Purvis T, Vaughn J M, Rogers T L, Chen X, Overhoff K A, Sinswat P, Hu J, McConville J T, Johnston K P, Williams R O 3rd. Cryogenic liquids, nanoparticles, and microencapsulation. International Journal of Pharmaceutics, 2006, 324(1): 43−50
CrossRef ADS Pubmed Google scholar
[37]
Yildiz Y, Nalbant M. A review of cryogenic cooling in machining processes. International Journal of Machine Tools & Manufacture, 2008, 48(9): 947−964
CrossRef ADS Google scholar
[38]
Hong S Y. Economical and ecological cryogenic machining. Journal of Manufacturing Science and Engineering, 2001, 123(2): 331−338
CrossRef ADS Google scholar
[39]
Pacio J C, Dorao C A. A review on heat exchanger thermal hydraulic models for cryogenic applications. Cryogenics, 2011, 51(7): 366−379
CrossRef ADS Google scholar
[40]
Gorla R S R. Rapid calculation procedure to determine the pressurizing period for stored cryogenic fluids. Applied Thermal Engineering, 2010, 30(14−15): 1997−2002
CrossRef ADS Google scholar
[41]
Liu J. Development of new generation miniaturized chip-cooling device using metal with low melting point or its alloy as the cooling fluid. In: Proceedings of the International Conference on Micro Energy Systems. Sanya, China, 2005, 89−97
[42]
Smither R K. Liquid metal cooling of synchrotron optics. In: Society of Photo-Optical Instrumentation Engineers (SPIE) International Symposium on Optical Applied Science and Engineering, San Diego, USA, 1992, 116−134
[43]
Iida T, Guthrie R I L. The Physical Properties of Liquid Metals. Oxford: Clarendon Press, 1993
[44]
Shimoji M. Liquid Metals: An Introduction to the Physics and Chemistry of Metals in the Liquid State. New York: Academic Press, 1977
[45]
Karcher C, Kocourek V, Schulze D. Experimental investigations of electromagnetic instabilities of free surfaces in a liquid metal drop. In: International Scientific Colloquium Modelling for Electromagnetic Processing. Hannover, Germany, 2003, 105−110
[46]
Wikipedia. NaK. 2013-05-26
[47]
Bradhurst D H, Buchanan A S. Surface properties of liquid sodium and sodium potassium alloys in contact with metal-oxide surfaces. Australian Journal of Chemistry, 1961, 14(3): 397−408
CrossRef ADS Google scholar
[48]
Chu K Y. Sodium loses its luster: A liquid metal that's not really metallic.
[49]
Wikipedia. Mercury (element). 2013-05-26
[50]
Senese F. Why is mercury a liquid at STP? 2013-05-26
[51]
Norrby L J. Why is mercury liquid? Or, why do relativistic effects not get into chemistry textbooks? Journal of Chemical Education, 1991, 68(2): 110−113
CrossRef ADS Google scholar
[52]
Lide D R. CRC Handbook of Chemistry and Physics (86th ed.). Boca Raton (FL): CRC Press. 2005, 4.125−4.126
[53]
MDCH. Mercury and Your Health.
[54]
Lovegrove R. Artemide Mercury Suspension. 2013-05-26
[55]
Dental Amalgam P E I. 2013-05-26
[56]
Vargel C, Jacques M, Schmidt M P. Corrosion of Aluminium. Elsevier, 2004, 158
[57]
Anderson T J, Ansara I. The Ga-Sn (Gallium-Tin) system. Journal of Phase Equilibria, 1992, 13(2): 181−189
CrossRef ADS Google scholar
[58]
Surmann P, Zeyat H. Voltammetric analysis using a self-renewable non-mercury electrode. Analytical and Bioanalytical Chemistry, 2005, 383(6): 1009−1013
CrossRef ADS Pubmed Google scholar
[59]
Ghoshal U, Grimm D, Ibrani S, Johnston C, Miner A. High-performance liquid metal cooling loops. In: Proceedings of the 21th IEEE Semiconductor Thermal Measurement and Management Symposium. San Jose, USA, 2005, 16−19
[60]
Liu G Y, Tan H D. Gallium and gallium compounds. In: Cyclopaedia of Chemical Engineering: Metallurgy and Metallic Materials. Beijing: Chemical Industry Press, 1994, 329−335(in Chinese)
[61]
Schormann M, Klimek K S, Hatop H, Varkey S P, Roesky H W, Lehmann C, Röpken C, Herbst-Irmer R, Noltemeyer M. Sodium-potassium alloy for the reduction of monoalkyl aluminum (III) compounds. Journal of Solid State Chemistry, 2001, 162(2): 225−236
CrossRef ADS Google scholar
[62]
Li H Y, Liu J. Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers. Frontiers in Energy, 2011, 5(1): 20−42
CrossRef ADS Google scholar
[63]
Kagan D N, Krechetova G A, Shpilrain E E. Elaborating and applying a new method of Gibbs energy determination for multicomponent alkali-metal coolants. Journal of Physics: Conference Series, 2008, 98(3): 032007
CrossRef ADS Google scholar
[64]
EnviroReporter.com. SSFL Area IV-SNAP. 2013-05-27
[65]
Dyson R W, Penswick B, Robbie M, Geng S M. Investigation of liquid metal heat exchanger designs for fission surface power. In: Sixth International Energy Conversion Engineering Conference (IECEC). Cleveland, USA, 2008, 1−6
[66]
Klinkrad H. Space Debris: Models and Risk Analysis. Springer, 2006, 83
[67]
Xie K W. Study on the liquid metal cooling method for thermal management of computer. Dissertation for the Master′s Degree. Beijing: the Chinese Academy of Science, 2009: 58−76
[68]
Butler H. Danamics LMX Superleggera Cooler Review. 2013-05-28
[69]
Oshe R W. Handbook of Thermodynamic and Transport Properties of Alkali Metals. Oxford. UK: Blackwell Scientific Publications Ltd, 1985, 987
[70]
Wikipedia. Fusible alloy. 2013-05-28
[71]
Rinck E. Diagram of solidification and electric conductivityof the potassium-cesium alloys. Comptes Rendus Hebdomadaires Des Seances De L'Academie Des Science, 1936, 203: 255−257
[72]
Shmueli U, Steinberg V, Sverbilova T, Voronel A. New crystalline phases of an equiatomic K-Cs alloy at low temperature. Journal of Physics and Chemistry of Solids, 1981, 42(1): 19−22
CrossRef ADS Google scholar
[73]
Simon A, Brumer W, Hillenkotter B, Kullmann H J. Novel compounds between potassium and cesium. Zeitschrift fur Anorganische und Allgemeine Chemie, 1976, 419: 253−274
CrossRef ADS Google scholar
[74]
Ren X, Li C R, Du Z M, Guo C P. Thermodynamic assessments of six binary systems of alkali metals. Calphad, 2011, 35(3): 446−454
CrossRef ADS Google scholar
[75]
Saunders N, Miodownik A P. CALPHAD (Calculation of Phase Diagrams—A Comprehensive Guide. Elsevier Science Ltd., 1998
[76]
Kaufman L, Bernstein H. Computer Calculation of Phase Diagrams. New York: Academic Press, 1970
[77]
Wikipedia. Eutectic system. 2013-05-28
[78]
Von Buch F, Lietzau J, Mordike B L, Pisch A, Schmid-Fetzer R. Development of Mg-Sc-Mn alloys. Materials Science and Engineering A, 1999, 263(1): 1−7
CrossRef ADS Google scholar
[79]
Grobner J, Schmid-Fetzer R. Selection of promising quaternary candidates from Mg–Mn–(Sc, Gd, Y, Zr) for development of creep-resistant magnesium alloys. Journal of Alloys and Compounds, 2001, 320(2): 296−301
CrossRef ADS Google scholar
[80]
Ohno M, Mirkovic D, Schmid-Fetzer R. Phase equilibria and solidification of Mg-rich Mg-Al-Zn alloys. Materials Science and Engineering A, 2006, 421(1−2): 328−337
CrossRef ADS Google scholar
[81]
Tang R Z, Tian R Z. Binary eutectic phase diagram and the crystal structures of intermediate phase. Changsha:Zhongnan University Press, 2009, 736 (in Chinese)
[82]
Newhouse W H, Hagner A F, Devore G W. Structural control in the formation of gneisses and metamorphic rocks. Science, 1949, 109(2825): 168−169
CrossRef ADS Pubmed Google scholar
[83]
Wang L, Liu J. Discontinuous structural phase transition of liquid metal and alloys. Physics Letters [Part A], 2004, 328(2−3): 241−245
CrossRef ADS Google scholar
[84]
Zhang Y N, Wang L, Wang W M, Zhou J K. Structural transition of sheared-liquid metal in quenching state. Physics Letters [Part A], 2006, 355(2): 142−147
CrossRef ADS Google scholar
[85]
Prabhu K N, Ravishankar B N. Effect of modification metal treatment on casting/chill interfacial heat transfer and electrical conductivity of Al-13% Si alloy. Materials Science and Engineering A, 2003, 360(1−2): 293−298
CrossRef ADS Google scholar
[86]
Shim J H, Lee S C, Lee B J, Suh J Y, Cho Y W. Molecular dynamics simulation of the crystallization of a liquid gold nanoparticle. Journal of Crystal Growth, 2003, 250(3−4): 558−564
CrossRef ADS Google scholar
[87]
Li H, Bian X F, Wang G H. Molecular dynamics computation of the liquid structure of Fe50Al50 alloy. Materials Science and Engineering A, 2001, 298(1−2): 245−250
CrossRef ADS Google scholar
[88]
Chen X S, Zhao J J, Sun Q, Liu F, Wang G, Shen X C. Surface thermal stability of nickel clusters. Physica Status Solidi. B, Basic Research, 1996, 193(2): 355−361
CrossRef ADS Google scholar
[89]
Hattori T, Kinoshita T, Taga N, Takasugi Y, Mori T, Tsuji K. Pressure and temperature dependence of the structure of liquid InSb. Physical Review B: Condensed Matter and Materials Physics, 2005, 72(6): 064205
CrossRef ADS Google scholar
[90]
Turnbull D. The Subcooling of liquid metals. Journal of Applied Physics, 1949, 20(8): 817
CrossRef ADS Google scholar
[91]
Li T, Lv Y G, Liu J, Zhou Y X. A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid. Forschung im Ingenieurwesen, 2005, 70(4): 243−251
CrossRef ADS Google scholar
[92]
Liu Z, Bando Y, Mitome M, Zhan J H. Unusual freezing and melting of gallium encapsulated in carbon nanotubes. Physical Review Letters, 2004, 93(9): 095504
CrossRef ADS Pubmed Google scholar
[93]
Platzek D. Liquid metal undercooled below its Curie temperature. Physical Review Letters, 1994, 65(13): 1723−1724
[94]
Wei B B, Yang G C, Zhon Y H. High undercooling and rapid solidification of Ni 32.5%Sn eutectic alloy. Acta Metallurgica et Materialia, 1991, 39(6): 1249−1258
CrossRef ADS Google scholar
[95]
Liu R P, Volkraann T, Herlach D M. Undereooling and solidification of Si by electromagnetic levitation. Acta Materialia, 2001, 49(3): 439−444
CrossRef ADS Google scholar
[96]
Hofmeister W H, Robinson M B, Bayuzick R J. Undercooling of pure metals in a containerless, microgravity environment. Applied Physics Letters, 1986, 49(20): 1342−1344
CrossRef ADS Google scholar
[97]
Bosio L, Windsor C G. Observation of a metastability limit in liquid gallium. Physical Review Letters, 1975, 35(24): 1652−1655
CrossRef ADS Google scholar
[98]
Cicco A D. Phase transitions in confined gallium droplets. Physical Review Letters, 1998, 81(14): 2942−2945
CrossRef ADS Google scholar
[99]
Parravicini G B, Stella A, Ghignaa P, Spinolo G, Migliori A, d’Acapito F, Kofman R. Extreme undercooling (down to 90 K) of liquid metal nanoparticles. Applied Physics Letters, 2006, 89(3): 033123
CrossRef ADS Google scholar
[100]
Taylor L T, Rancourt J. Non-toxic liquid metal composition for use as a mercury substitute. United States Patent No. 5,792, 236. 1998-08-11
[101]
Wu Y Y, Liu X F, Liu X J, Bian X F. Effect of Sb, Bi and Fe on melting points and microstructures of eutectic Cu-8P alloys. Chinese Journal of Nonferrous Metals, 2004, 14(7): 1206−1210
[102]
ARMY. Hermes® 90 UAS unmanned aircraft system. 2013-05-28
[103]
LOCKHEED MARTIN. IRST sensor system. 2013-06-01
[104]
NORTHROP GRUMMAN. 2008photo archive.2013-06-01
[105]
Cortney. China Launches Beidou GPS System, Set to Rival US GPS. 2012-01-03

Acknowledgments

This work was supported in part by the China Postdoctoral Science Foundation (No. 2012M510561).

版权

2013 Higher Education Press and Springer-Verlag Berlin Heidelberg
PDF(548 KB)

Accesses

Citation

Detail

段落导航
相关文章

/