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ISSN 2095-7513 (Print)
ISSN 2096-0255 (Online)
CN 10-1205/N
Postal Subscription Code 80-905
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     编委会
 
Editors-in-Chief:
Jishan HE, Member of the Chinese Academy of Engineering, Central South University, China    
Wenrui HU, Member of the Chinese Academy of Engineering, China    
Mirosław SKIBNIEWSKI, Foreign Member of the Russian Academy of Engineering and Full Member of the Academy of Engineering in Poland, University of Maryland, USA   

Executive Editor-in-Chief:
Lieyun DING, Member of the Chinese Academy of Engineering, Huazhong University of Science and Technology, China   

Deputy Editors-in-Chief:
Qiao XIANG, Member of the Chinese Academy of Engineering, China
Xiaohong CHEN, Member of the Chinese Academy of Engineering, Hunan University of Commerce, China   
Lan XUE, Tsinghua University, China   

Executive Deputy Editor-in-Chief:
Hongwei WANG, Huazhong University of Science and Technology, China    

Editorial Advisory Board Members (member of the Chinese Academy of Engineering):
Qingquan CHEN, Member of the Chinese Academy of Engineering, The University of Hong Kong, Hong Kong, China   
Zhihuan FU, Member of the Chinese Academy of Engineering, China    
Renhuai LIU, Member of the Chinese Academy of Engineering, Jinan University, China     
Youmei LU, Member of the Chinese Academy of Engineering, China    
EnJie LUAN, Member of the Chinese Academy of Engineering, China     
Yongfu SUN, Member of the Chinese Academy of Engineering, China    
An WANG, Member of the Chinese Academy of Engineering, China   
Liheng WANG, Member of the Chinese Academy of Engineering, China   
Yingluo WANG, Member of the Chinese Academy of Engineering, Xi'an Jiaotong University, China    
Yupu WANG, Member of the Chinese Academy of Engineering, China   
Jiming WANG, Member of the Chinese Academy of Engineering, China   
Longde WANG,Member of the Chinese Academy of Engineering, China    
Zhongtuo WANG, Member of the Chinese Academy of Engineering, Dalian University of Technology, China   
Shoubo XU, Member of the Chinese Academy of Engineering, Beijing Jiaotong University, China    
Qingrui XU, Member of the Chinese Academy of Engineering, Zhejiang University, China    
Ruiyu YIN, Member of the Chinese Academy of Engineering, Central Iron and Steel Research Institute, China   
Qingtang YUAN, Member of the Chinese Academy of Engineering, China   
Gaofeng ZHU, Member of the Chinese Academy of Engineering, China    
Venkatesh NARAYANAMURTI, Harvard University, USA   

Editorial Board Members:
Jun BI, Nanjing University, China    
Naomi BROOKES, University of Leeds, UK    
Li CAI, Jilin University, China    
Yaofeng CAO, Member of the Chinese Academy of Engineering, China  
Hongfeng CHAI, Member of the Chinese Academy of Engineering, China UnionPay,National engineering laboratory of electronic commerce and electronic payment    
Jin CHEN, Tsinghua University, China   
Weiwei CHEN, Rutgers University, USA
Jinliang DING, Northeastern University, China    
Wenli DU, East China University of Science and Technology, China   
Dongping FANG, Tsinghua University, China    
Ziyou GAO, Beijing Jiaotong University, China   
Mike GREGORY, University of Cambridge, UK    
Ignacio GROSSMANN, Carnegie Mellon University, USA    
Madan GUPTA, University of Saskatchewan, Canada    
Miklós HAJDU, Budapest University of Technology and Economics, Hungary  
Timo HARTMANN, TU Berlin,Germany    
Xiangpei HU, Dalian University of Technology, China     
Zhongsheng HUA, Zhejiang University, China     
Jikun HUANG, Peking University, China    
Wei HUANG, Xi'an Jiaotong University, China    
Michael C. JACKSON, University of Hull, UK     
Zhibin JIANG, Shanghai Jiao Tong University, China    
Jian KANG, University College London, UK    
Takashi KANETA, Kyoto University 
Dundar KOCAOGLU, Portland State University, USA     
Heng LI, The Hong Kong Polytechnic University, Hong Kong, China    
Yongkui LI, Tongji University, China    
Zheng LI, Tsinghua University, China    
Wen LING, Member of the Chinese Academy of Engineering, China
Xiaojun LIU, Xi`an University of Architecture and Technology, China    
Peter E. D. LOVE, Curtin University, Australia    
Hanbin LUO, Huazhong University of Science and Technology, China     
Benachir MEDJDOUB, Nottingham Trent University, UK    
Panos M. PARDALOS, University of Florida, USA     
Feniosky PEÑA-MORA, Columbia University, USA    
Mladen RADUJKOVIĆ, Alma Mater Europaea ECM,Slovenia     
Hong REN, Chongqing University, China    
Anlin SHAO, Member of the Chinese Academy of Engineering,     
Lixin TANG, Northeastern University, China   
Jiafu TANG, Dongbei University of Finance and Economics, China    
Pingbo TANG,Arizona State University,USA    
Edison TSE, Stanford University, USA    
Huimin WANG, Hohai University, China   
Mengjun WANG, Central South University, China    
Xianjia WANG, Wuhan University, China   
Yaowu WANG, Harbin Institute of Technology, China    
Yiming WEI, Beijing Institute of Technology, China    
Quan WEN, University of Washington, USA   
Chip WHITE, Georgia Institute of Technology, USA   
Bogdan M. WILAMOWSKI, Auburn University, USA   
Desheng WU, University of Chinese Academy of Sciences, China    
Jianjun WU, Beijing Jiaotong University, China     
Qidi WU, Tongji University, China    
Lida XU, Old Dominion University, USA     
Jianbo YANG, the University of Manchester, UK   
Qiang YE, Harbin Institute of Technology, China     
Hai YANG, Hong Kong University of Science and Technology, Hong Kong, China 
Shanlin YANG, Member of the Chinese Academy of Engineering, Hefei University of Technology, China   
Saixing ZENG, Shanghai Jiao Tong University, China  
Xiaozhe ZHAO, Member of the Chinese Academy of Engineering, PLA Dalian Naval Academy, China   
Jingchen ZHENG, Member of the Chinese Academy of Engineering, China    
Jianping ZHOU, Member of the Chinese Academy of Engineering, China   



 
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