Binxing Fang China Electronics Corporation, China
Philip Yu, University of Illinois at Chicago, USA

 

Yan Jia, National University of Defense Technology, China
Kui Ren, New York State University, USA

 

Ahmad-reza Sadeghi, Technische University Darmstadt, USA
Anna Squicciarini, Penn State University, USA
Aziz Mohaisen, State University of New York at Buffalo, USA
Changzhen Hu, Beijing Institute of Technology, China
Chunming Hu, Beihang University, China
Elisa Bertino, Purdue University, USA
Florian Kerschbaum, SAP, USA
Gail-Joon Ann, Arizona State University, USA
Gerhard Hancke, City University of Hong Kong
Guevara Noubir, Northeastern University, USA
Hai Jin, Huazhong University of Science and Technology, China
Hongli Zhang, Harbin Institute of Technology, China
Jian Weng, Jinan University, China
Jianfeng Ma, Xidian University, China
Jianhua Li, Shanghai Jiaotong University, China
Jin Xu, Peking University, China
Jiwu Huang, Sun Yat - sen University, China
Junmin Park, Virginia Tech, USA
Matthew Wright, Rochester Institute of Technology, USA
Mauro Conti, University of Padua, USA
Moti Yung, Snapchat, USA
Nei Kato,Tohoku University, USA
Nenghai Yu, University of Science and Technology of China, China
Pierangela Samarati, University of Milan, Italy
Ravi Sandu, University of Texas at Arlington, USA
Roberto Di Pietro, Nokia Bell Labs, USA
Sheng Zhong, Nanjing University, China
Willy Susilo, University of Wollongong, USA
Xiaoyang Wang, Fudan University, China
Yongdae Kim, Korea Advanced Institute of Science and Technology, South Korea
Zhong Chen, Peking University, China
Zhoujun Li, Beihang University, China